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Multi-Die Heterogeneous Integration or the Next Era of Moore’s Law

Muhannad S. Bakir, Ph.D.
School of Electrical and Computer Engineering
Georgia Institute of Technology

Date: Friday, February 16, 2018; 11:00am - 12:00pm
Cost: Free and open to the public
Location: Physical Science Building, Room 160

This presentation will discuss high-density multi-die integration approaches both in 2.5D and 3D ICs. Specifically, we first discuss various 2.5D approaching including Heterogeneous Interconnect Stitching Technology (HIST), which enables the interconnection of multiple dice of various functionalities (including photonics) in a manner that mimics monolithic-like performance, yet utilizes advanced off-chip interconnects and packaging to provide flexibility in IC fabrication and design, improved scalability, reduced development time, and reduced cost. A key feature of HIST is the ability to place a 'stitch chip' between adjacent ICs on the surface of an organic/ceramic package and use I/Os to interface the active dice to the package and stitch chips simultaneously. Design considerations and benchmarking (power delivery, signaling, and thermal) will be described and experimental demonstrations will be shown. Secondly, we demonstrate embedded microfluidic cooling in 3D ICs along with TSV integration approaches; a 28nm FPGA with monolithic microfluidic cooling along with its performance benefits will also be discussed. Third, and lastly, we discuss 3D IC applications in CMOS multimodal biosensors.

Biography

Dr. Muhannad S. Bakir is a Professor in the School of Electrical and Computer Engineering at Georgia Tech. Dr. Bakir and his research group have received more than twenty five conference and student paper awards including six from the IEEE Electronic Components and Technology Conference (ECTC), four from the IEEE International Interconnect Technology Conference (IITC), and one from the IEEE Custom Integrated Circuits Conference (CICC). Dr. Bakir’s group was awarded the 2014 Best Paper of the IEEE Transactions on Components Packaging and Manufacturing Technology in the area of advanced packaging. Dr. Bakir is the recipient of the 2013 Intel Early Career Faculty Honor Award, 2012 DARPA Young Faculty Award, 2011 IEEE CPMT Society Outstanding Young Engineer Award, and was an Invited Participant in the 2012 National Academy of Engineering Frontiers of Engineering Symposium. In 2015, Dr. Bakir was elected by the IEEE CPMT Society to serve as a Distinguished Lecturer for a four-year term.

Dr. Bakir is Co-Editor-in-Chief of the IEEE Transactions on Components, Packaging and Manufacturing Technology and an Editor of IEEE Transactions on Electron Devices.

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