Promise of 2D Materials

Two dimensional materials, by the virtue of their unique properties and excellent electrostatic integrity, provide immense opportunities not only to explore fundamental physics but also to solve critical technological problems across all scientific and engineering disciplines. In my talk, I will take a holistic approach that will combine material, device as well as circuit aspects of these 2D materials. I will discuss the use of Graphene as a metal, hexagonal-BN as an insulator and Phosphorene, MoS₂, WSe₂ and many others transition metal dichalcogenides (TMDs) as semiconductors. Then, I will demonstrate how “Contact Engineering” can be implemented to connect the three dimensional world to these 2D materials to enhance their performance. Next, I will talk about various “Scaling Aspects” of 2D materials. Finally I will discuss the “Integration and Application” of 2D materials for flexible and transparent electronics as well as low power device/circuit design. I will conclude the talk with my “Future Research” objectives with 2D materials and beyond.

Biography

I received my bachelor degree in Electronics and Telecommunication Engineering from Jadavpur University, India in 2003. I joined Purdue University in 2007 and finished my Doctorate degree in the area of Micro and Nano Technology from the department of Electrical and Computer Engineering in May 2013. Currently I am jointly affiliated with the Center for Nanoscale Material at the Argonne National Laboratory and with the Birck Nanotechnology Center at the Purdue University as Post-doctoral Research scientist. I have worked in the Carbon Technology group at IBM T.J.Watson Research Center in 2009 and in the 22nm System and Technology group at IBM East Fishkill in 2011 as summer interns. I have also received the IBM PhD fellowship for the year 2011-12. My research focuses on experimental investigation of device physics in low dimensional systems like nanotubes, nanowires and more recently the two dimensional layered materials for low power and high speed electronic and optoelectronics applications.